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Conference
(頂尖會議) Hong-De Lin, Yuan-Chun Su, Tzu-Chuan Su, Elia Ambrosi, Cheng-Hsien Wu, Cheng-Chen Kuo, Chih-Yu Chang, Hung-Li Chiang, Ting-Hua Wei, Yu-Wei Hsu, Ching-Shuan Huang, Sin-Yue Lee, Wei-Ning Chang, Jui-Han Fu, Vincent Tung, Jack Y-C Sun, Chenming Hu, Chih-I Wu, Chao-Cheng Lin, Tuo-Hung Hou, Xinyu Bao, Tsung-En Lee, “First Demonstration of Heterogeneous n-IGZO/p-WSe2 Integration as a Power-Performance Area Booster for BEOL Complementary Gain-Cell Memory,” 2026 IEEE/JSAP Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), Honolulu, HI, USA, 2026, pp. 1-3, doi: 10.1109/VLSITechnologyandCir65830.2026.11577393.
(頂尖會議) E. AmbrosiS. Ricci, C. C. Kuo, M. Y. Song, C. H. Wu, C. H. Lin, W. H. Lu, C. Y. Hu C. X. He, ,X. H. Huang, S. Vaziri, C. F. Hsu, H. Y. Lee, Y. J. Chen, C. C. Lin, C. Y. Lo, H. H. Lee, G. L. Chen, Y. C. Hsin, W. Y. Woon, J. H. Wei, K. S. Li, T. H. Hou, K. L. Lin, C. N. Liu, X. Y. Bao, “Scalable and Stackable 2S1M SOT-MRAM Memory Cell Enabled by Two-Terminal Write and Read SNGCT Chalcogenide Selectors,” 2026 IEEE/JSAP Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), Honolulu, HI, USA, 2026, pp. 1-3, doi: 10.1109/VLSITechnologyandCir65830.2026.11577463.
(頂尖會議) C-Y. Cho, Y. -L. Shih, M. -Y. Lao, Y. -A. Chen, Y. -D. Lin, P. -C. Yeh, S. -S. Sheu, T. -H. Hou, “Origin and Modeling of the Access-Rate-Dependent Degradation and Dual-Interface Optimization in Ultra-Thin Nanolaminate HZO,” 2026 IEEE/JSAP Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), Honolulu, HI, USA, 2026, pp. 1-3, doi: 10.1109/VLSITechnologyandCir65830.2026.11577521.
M.-C. Hong, H. -H. Lee, G. -L. Chen, S. -Y. Huang, C. -Y. Lo, Y. -H. Su, H. -L. Tsai, S. -C. Chiu, C. -Y. Shih, Y. -J. Chang, C. -Y. Wang, S. -Y. Yang, Y. -C. Hsin, J. -H. Wei, S. -S. Sheu, W. -C. Lo, S. -C. Chang, T. -H. Hou, “High-RA STT-MRAM for In-Memory Computing: From Device Engineering to Prototype-IMC Validation,” 2026 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA), HsinChu, Taiwan, 2026, pp. 1-2, doi: 10.1109/VLSITSA69131.2026.11527860.